| 摘要 |
<p>The package for electronic components (1) comprises a package (2) and, in the package, a printed-circuit board (7) and components mounted on the board (7), leaving some (11) to be protected and covered by an EMC screening cover (12) electrically connected to the printed circuit on the board (7) and a lid for closing the package, characterized in that the cover (12) is electrically connected to the printed circuit of the board (7) via sliding contact elements (18, 19). Thanks to the method of the invention, the cover will cover the components to be protected after they have been soldered to the board when placing the board in the package. This makes it possible to check the soldered joints of the components to be protected in the normal way.</p> |
