<p>A method of manufacturing a FIN FET forms a first active pin having a first line width in a first area on a semiconductor substrate, and a second active pin having a second line width narrower than the first line width in a second region of the semiconductor substrate. A gate oxide layer is formed on surfaces of the first and second active pins through a deposition process. A gate electrode is formed on the gate oxide layer. The FIN FET formed through the above process is highly integrated and represents an excellent electrical characteristic.</p>
申请公布号
KR20140088784(A)
申请公布日期
2014.07.11
申请号
KR20130000722
申请日期
2013.01.03
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
LEE, HYE LAN;HYUN, SANG JIN;KANG, SANG BOM;SONG, JAE YEOL;LEE, JUNE HEE