PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED WIRING BOARD

摘要

[Problems] The present invention provides a photosensitive resin composition having good resistance to electroless gold plating and excellent filling property into a through hole, from which a cured product where a defect in the outer appearance of a cured film caused by bumping in a through hole is inhibited can be obtained; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition comprises (A) a photosensitive carboxylic acid resin and (B) a liquid bifunctional epoxy resin and is characterized by comprising (C) an aluminum-containing inorganic filler in an amount of not less than 200 parts by mass with respect to 100 parts by mass of total carboxylic acid resins.