Lamp device i.e. LED device, has set of fins placed on upper surface of upper part of case to increase heat dissipation zones, and set of screw holes formed on copper substrate to fix lamps, where substrate is attached to cavity of case

摘要

The device has a set of fins (11) placed on an upper surface of an upper part of a rectangular case (1) to increase heat dissipation zones. The fins are placed along a longitudinal direction of the case so as to form a set of longitudinal air grooves between the fins. Transverse air grooves (110) are formed to cross through the fins, where sufficient amount of air is present in an inner side of the grooves between the fins by provision of the grooves. A copper substrate is attached to a cavity of the case. A set of screw holes is formed on the substrate to fix lamps i.e. LEDs.