发明名称 |
COPPER ALLOY HOT-ROLLED SHEET FOR SPUTTERING TARGET, AND SPUTTERING TARGET |
摘要 |
PROBLEM TO BE SOLVED: To provide a Cu-Ca-based copper alloy hot-rolled sheet for sputtering target, which is capable of suppressing generation of abnormal discharge in sputtering, and a sputtering target using the same.SOLUTION: Provided is a Cu-Ca-based copper alloy hot-rolled sheet containing Ca of 0.5 to 10.0 atomic%, with the balance substantially being Cu, in which the average grain size of Cu-α phase grains in the base alloy is regulated within the range of 5 to 60 μm. |
申请公布号 |
JP2014129580(A) |
申请公布日期 |
2014.07.10 |
申请号 |
JP20120288705 |
申请日期 |
2012.12.28 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
OKUBO KIYOYUKI;KOIDE MASATO |
分类号 |
C22C9/00;B22D11/00;C22C9/01;C22C9/05;C22F1/00;C22F1/08;C23C14/34 |
主分类号 |
C22C9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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