发明名称 COPPER ALLOY HOT-ROLLED SHEET FOR SPUTTERING TARGET, AND SPUTTERING TARGET
摘要 PROBLEM TO BE SOLVED: To provide a Cu-Ca-based copper alloy hot-rolled sheet for sputtering target, which is capable of suppressing generation of abnormal discharge in sputtering, and a sputtering target using the same.SOLUTION: Provided is a Cu-Ca-based copper alloy hot-rolled sheet containing Ca of 0.5 to 10.0 atomic%, with the balance substantially being Cu, in which the average grain size of Cu-α phase grains in the base alloy is regulated within the range of 5 to 60 μm.
申请公布号 JP2014129580(A) 申请公布日期 2014.07.10
申请号 JP20120288705 申请日期 2012.12.28
申请人 MITSUBISHI MATERIALS CORP 发明人 OKUBO KIYOYUKI;KOIDE MASATO
分类号 C22C9/00;B22D11/00;C22C9/01;C22C9/05;C22F1/00;C22F1/08;C23C14/34 主分类号 C22C9/00
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