| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer processing body, a member for wafer processing and a temporary adhering material for wafer processing, in which temporary adhesion between a wafer and a support is easily achieved, an adhering material layer with a uniform film thickness can be formed even on a substrate having a stepped part with a large height, high process adaptability is obtained for formation of TSV (through silicon via) and for a wiring process on a wafer back surface, and the adhering material is easily peeled, enhancing productivity of a thin wafer, and to provide a method for manufacturing a thin wafer using these materials.SOLUTION: The wafer processing body includes: a temporary adhering material layer on a support; and a wafer having a circuit surface on a top surface thereof and having a back surface to be processed, layered on the temporary adhesion material. The temporary adhering material layer includes a composite temporary adhering material layer having a three-layer structure of: a first temporary adhering layer which is adhered in a peelable manner to the top surface of the wafer and comprises a non-silicone thermoplastic resin layer (A); a second temporary adhering layer which is layered on the first temporary adhering layer and comprises a thermoplastic siloxane resin polymer layer (B); and a third temporary adhering layer which is laminated on the second temporary adhering layer, is adhered in a peelable manner to the support and comprises a thermosetting siloxane modified polymer layer (C). |
