| 摘要 |
<p>PROBLEM TO BE SOLVED: To effectively inhibit flow of a conductive paste during the lamination thereby improving the reliability of interlayer connection.SOLUTION: In a multi-layer printed wiring board 100, first and second printed wiring base materials 10, 20, in which first and second conductor circuit layers 11, 12 are respectively formed, are laminated through an adhesive layer 9. The first conductor circuit layer 11 of the first printed wiring base material 10 and the second conductor circuit layer 12 of the second printed wiring base material 20 are connected with each other through a via 14 which penetrates through a first insulation base material 19 and the adhesion layer 9 in a lamination direction. An insulation layer 15 functioning as an outflow prevention part that prevents a conductive member forming the via 14 from flowing out to the adhesive layer 9 is provided on a surface 10b of the first insulation base material 19. When heating press is performed on the first and second printed wiring base materials 10, 20, the insulation layer 15 prevents the conductive member forming the via 14 from flowing out and dispersing to the adhesive layer 9. Thus, the connection reliability of interlayer connection is improved.</p> |
