| 摘要 |
A device (1) for holding a planar substrate (4), in particular for a wafer or an eWLB, is shown, with a support (2) which forms a supporting surface (3) for the substrate (2) and has at least one recess (5) provided in the region of the supporting surface (3) for the substrate (2), and with at least one holding means which is connected in terms of flow to said recess (6) and is intended for fixing the substrate (2) on the device (1) with the aid of a vacuum generated between the support (2) and substrate (4). In order to be able to grip a multiplicity of substrates of geometrically differing profile, it is proposed that the support (2) has at least one recess (6) with an elastic seal (7) which is designed to be movable from a position (9) protruding over the edge (8) of the recess (6) into a position (10) pulled back in relation to the edge (8) of the recess (6) or at most corresponding to said edge and which interacts with the recess (5) for sucking the full area of the substrate (4) onto the support (2). |
| 主权项 |
1. Apparatus for holding a planar substrate (4), particularly for a wafer and/or eWLB, having a support (2) that forms a supporting surface (3) for the substrate (4), which has at least one recess (5) provided in the region of the supporting surface (3) for the substrate (4), and having at least one holding means (13) connected with this recess (5), in terms of flow, for fastening the substrate (4) onto the apparatus (1), using a partial vacuum generated between support (2) and substrate (4), wherein the support (2) has at least one recess (6) having an elastic seal (7), which is configured so that it can be moved from a position projecting beyond the edge (8) of the recess (6) into a position pulled back in relation to the edge (8) of the recess (6) or at most agreeing with this position (9, 10), and which works together with the recess (5) to draw the substrate (4) against the support (2) over its full area, by suction. |
