| 发明名称 |
IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOF |
| 摘要 |
An image sensor chip package is disclosed, which includes a substrate, an image sensor component formed on the substrate, a spacer formed on the substrate and surrounding the image sensor component, and a transparent plate. A stress notch is formed on a side of the transparent plate, and a breaking surface is extended from the stress notch. A method for fabricating the image sensor chip package is also disclosed. |
| 申请公布号 |
US2014191350(A1) |
申请公布日期 |
2014.07.10 |
| 申请号 |
US201414150637 |
申请日期 |
2014.01.08 |
| 申请人 |
XINTEC INC. |
发明人 |
CHEN Chih-Hao;LOU Bai-Yao;CHEN Shih-Kuang |
| 分类号 |
H01L31/0232;H01L27/146 |
主分类号 |
H01L31/0232 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An image sensor chip package, comprising:
a substrate; an image sensor component formed on the substrate; a spacer formed on the substrate and surrounding the image sensor component; and a transparent plate disposed on the spacer, wherein the transparent plate comprises a stress notch and a breaking surface extended from the stress notch. |
| 地址 |
Zhongli City TW |
