| 发明名称 |
POLYMER/INORGANIC MULTI-LAYER ENCAPSULATION FILM |
| 摘要 |
This invention relates to a polymer/inorganic multi-layer encapsulation film, and more particularly, to a multi-layer encapsulation film, which includes a plasma polymer thin film layer formed using a cross-shaped precursor having Si—O bonding and an inorganic thin film layer, and ensures flexibility and has improved encapsulation. |
| 申请公布号 |
US2014190565(A1) |
申请公布日期 |
2014.07.10 |
| 申请号 |
US201414149852 |
申请日期 |
2014.01.08 |
| 申请人 |
RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY |
发明人 |
JUNG Dong Geun;CHAE Heeyeop;PARK Min Woo;KIM Hoon Bae;LEE Chae Min |
| 分类号 |
H01L51/10;H01L51/52;H01L51/44 |
主分类号 |
H01L51/10 |
| 代理机构 |
|
代理人 |
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| 主权项 |
1. A multi-layer encapsulation film, comprising:
a plasma polymer thin film layer formed by using a precursor represented by Chemical Formula 1 below; and an inorganic thin film layer: wherein R1 to R12 are each independently H or C1-C5 alkyl. |
| 地址 |
SUWON-SI KR |
