| 摘要 |
<p>In the present invention, when a control device that controls an XY table (9) and a galvano scanner moves a machining area (82) on a machining subject to a galvano area, when the machining area (82) enters an in-position range having a pre-set distance from the target coordinates of motion, cooperative control for positioning a laser light within the galvano area is started while moving the XY table (9) without stopping, and the cooperative control is executed until the machining area (82) reaches the galvano area and the XY table is halted, by which means the cooperative control region in the machining area (82) is subjected to laser machining, and when the machining area (82) reaches the galvano area and the XY table is halted (9), the remaining machining regions in the machining area (82) are subjected to laser machining in the state of the XY table (9) being halted, thus easily improving the machining efficiency.</p> |
