INTEGRATED CIRCUIT PACKAGE AND METHOD OF MAKING

摘要

An integrated circuit (“IC”) device and method of making it. The IC device may include a conductive lead frame that has a die pad with a relatively larger central body portion and at least one relatively smaller peripheral portion in electrical continuity with the central body portion. The peripheral portion(s) project laterally outwardly from the central body portion of the die pad. Lateral displacement of a portion(s) of an encapsulation layer overlying the peripheral portion(s) is resisted by abutting surfaces on the peripheral portion(s) and the encapsulation layer.

主权项

1. An integrated circuit device comprising:
a conductive lead frame having a die pad that comprises:
a relatively larger central body portion;at least one relatively smaller peripheral portion in electrical continuity with said central body portion and projecting laterally outwardly from said central body portion and having at least one abutment surface thereon; a die having a plurality of conductor pads on a top surface thereof and having a bottom surface attached to said central body portion; at least one wire bonded at a first end thereof to one of said conductor pads and at a second end thereof to said at least one peripheral portion, and wherein no lead wire is connected between any of said conductor pads and said central body portion; an encapsulation layer covering said die, said wires and at least a portion of said lead frame and having a portion abuttingly engaging said at least one abutment surface so as to resist lateral displacement of said peripheral portion relative to said encapsulation layer in the proximity of said at least one abutment surface.