发明名称 SUBSTRATE PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus which can prevent mist generated at the time of cleaning support parts of a substrate from scattering and adhering to nozzles and nozzle arms which are arranged in a liquid treatment part of the substrate.SOLUTION: A substrate processing apparatus 1 comprises: a substrate transfer mechanism in which support parts 140a-140c for supporting a substrate W is provided; and a liquid treatment module 2 for performing a liquid treatment on the substrate W. The liquid treatment module 2 includes a housing 20 which includes: an entrance port 21 where the support parts enter; a liquid treatment part for performing a liquid treatment on the substrate W; a cleaning mechanism 6 for cleaning the support parts 140a-140c which entered the housing; a liquid discharging part 64 for discharging a cleaning liquid from inside the housing 20; and a sectioning wall 62 for sectioning a space for conducting cleaning of the support parts from another space in the housing. The sectioning wall 62 includes a passage port 631 where the support parts 140a-140c pass through.
申请公布号 JP2014130945(A) 申请公布日期 2014.07.10
申请号 JP20120288420 申请日期 2012.12.28
申请人 TOKYO ELECTRON LTD 发明人 OBARA TAKANORI;NAKAZAWA TAKASHI;KURUSU KENTO
分类号 H01L21/304;H01L21/677 主分类号 H01L21/304
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