发明名称 ENCAPSULATION OF SOLAR CELL
摘要 PROBLEM TO BE SOLVED: To provide a solar cell module that improves adhesiveness to an upper plate while reducing cost and labor for encapsulating the solar cell.SOLUTION: The solar cell module includes: i) a rigid or flexible upper plate and/or substrate; ii) one or more solar cells; and iii) a curing fluid silicone encapsulation material selected from a group composed of hydrosilylation curing reaction product, peroxide curing reaction product, and UV curing reaction product.
申请公布号 JP2014131055(A) 申请公布日期 2014.07.10
申请号 JP20140015468 申请日期 2014.01.30
申请人 DOW CORNING CORP 发明人 TERROE CHRISTINE;HABIMANNAH JEAN DE LA CROIX;STEPHEN JENKINS
分类号 H01L31/042;C08L83/05;C08L83/07;H01L31/0216;H01L31/048 主分类号 H01L31/042
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