| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for solving the cause of such problems as damage on a microstructure on the substrate surface and non-uniform cleaning, that the droplets of liquid spray are polydispersed.SOLUTION: Wet processing of a wafer shape article is improved by using a droplet generator designed to generate spray of monodispersed droplets. The droplet generator is attached to an upper part of a spin chuck, and is moved along a linear or arcuate path over the main surface of the wafer shape article. The droplet generator includes a converter coupled acoustically with the body so that the acoustic energy reaches a region of the body around a discharge orifice 150. Each orifice has at least a width w of 1-200 μm, and such a height h as the ratio to the w is 1 or less. |
