发明名称 ELECTROCONDUCTIVE PARTICLES, ELECTROCONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE
摘要 <p>PROBLEM TO BE SOLVED: To provide electroconductive particles capable of inhibiting flocculation and of inhibiting the occurrence of migration on the outer surface of an electroconductive layer.SOLUTION: The electroconductive particles 1 of the present invention include base particles 2 and electroconductive layers 3 configured on the surfaces of the base particles 2. The electroconductive layer 3 includes: at least one type selected from among nickel, boron, and phosphorus; and copper. The content of copper over the entire region of the electroconductive layer 3 on the outer surface side thereof commensurate with 1/3 of the thickness thereof is lower than the content of copper over the entire remaining region commensurate with 2/3 of the thickness thereof and comprising a middle region commensurate with 1/3 of the thickness of the electroconductive layer 3 and a region on the inner surface side commensurate with 1/3 of the thickness of the electroconductive layer 3.</p>
申请公布号 JP2014130809(A) 申请公布日期 2014.07.10
申请号 JP20130246572 申请日期 2013.11.28
申请人 SEKISUI CHEM CO LTD 发明人 NISHIOKA KEIZO
分类号 H01B5/00;C09J9/02;C09J11/00;C09J201/00;C22C19/03;H01B1/00;H01B1/22;H01B5/16;H01R11/01 主分类号 H01B5/00
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