发明名称 |
ELECTROCONDUCTIVE PARTICLES, ELECTROCONDUCTIVE MATERIAL, AND CONNECTION STRUCTURE |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide electroconductive particles capable of inhibiting flocculation and of inhibiting the occurrence of migration on the outer surface of an electroconductive layer.SOLUTION: The electroconductive particles 1 of the present invention include base particles 2 and electroconductive layers 3 configured on the surfaces of the base particles 2. The electroconductive layer 3 includes: at least one type selected from among nickel, boron, and phosphorus; and copper. The content of copper over the entire region of the electroconductive layer 3 on the outer surface side thereof commensurate with 1/3 of the thickness thereof is lower than the content of copper over the entire remaining region commensurate with 2/3 of the thickness thereof and comprising a middle region commensurate with 1/3 of the thickness of the electroconductive layer 3 and a region on the inner surface side commensurate with 1/3 of the thickness of the electroconductive layer 3.</p> |
申请公布号 |
JP2014130809(A) |
申请公布日期 |
2014.07.10 |
申请号 |
JP20130246572 |
申请日期 |
2013.11.28 |
申请人 |
SEKISUI CHEM CO LTD |
发明人 |
NISHIOKA KEIZO |
分类号 |
H01B5/00;C09J9/02;C09J11/00;C09J201/00;C22C19/03;H01B1/00;H01B1/22;H01B5/16;H01R11/01 |
主分类号 |
H01B5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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