METHOD OF BONDING A SUBSTRATE TO A SEMICONDUCTOR LIGHT EMITTING DEVICE

摘要

A method according to embodiments of the invention includes positioning a flexible film (48) over a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a semiconductor structure (13) including a light emitting layer sandwiched between an n-type region and a p-type region. The wafer of semiconductor light emitting devices is bonded to a substrate (50) via the flexible film (48). After bonding, the flexible film (48) is in direct contact with the semiconductor structures (13). The method further includes dividing the wafer after bonding the wafer to the substrate (50).

主权项

1. A method comprising:
positioning a flexible film over a wafer of semiconductor light emitting devices, each semiconductor light emitting device comprising a semiconductor structure comprising a light emitting layer sandwiched between an n-type region and a p-type region, wherein the flexible film is formed separate from the wafer, then positioned over the wafer; bonding a substrate to the wafer of semiconductor light emitting devices via the flexible film, wherein after bonding the flexible film is in direct contact with the semiconductor structure; and after bonding the wafer to the substrate, dividing the wafer.