发明名称 |
System and Method for Cleaning Semiconductor Fabrication Equipment Parts |
摘要 |
An exemplary embodiment discloses a process for cleaning semiconductor fabrication equipment parts with non-metallic surfaces. The process optionally includes providing a semiconductor fabrication part with a non-metallic surface to be cleaned and applying a dilute aqueous solution to remove contamination from the non-metallic surface. The aqueous solution optionally includes dilute amounts of hydrofluoric acid, nitric acid and hydrogen peroxide. The dilute amounts would optionally be in the ranges of 0.5-1.5% wt. hydrofluoric acid, 0.1-0.5% wt. nitric acid and 1-10% wt. hydrogen peroxide. |
申请公布号 |
US2014190937(A1) |
申请公布日期 |
2014.07.10 |
申请号 |
US201414209289 |
申请日期 |
2014.03.13 |
申请人 |
QUANTUM GLOBAL TECHNOLOGIES LLC |
发明人 |
Tan Samantha |
分类号 |
B44C1/22 |
主分类号 |
B44C1/22 |
代理机构 |
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代理人 |
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主权项 |
1. A method for removing particles on a textured surface of a semiconductor fabrication equipment part comprising: determining a chemical bonding characteristic of the particles; identifying a type of particles embedded in the textured surface; measuring a depth of any subsurface damage; and performing a combination of ultrasonication and chemical etching to the textured surface based upon said chemical bonding characteristics, said type of particles and said depth of subsurface damage. |
地址 |
Dublin PA US |