发明名称 Printed circuit boards including strip-line circuitry and methods of manufacturing same
摘要 <p>A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.</p>
申请公布号 AU2013209858(A1) 申请公布日期 2014.07.10
申请号 AU20130209858 申请日期 2013.01.16
申请人 JENSEN, JEFFREY;FRUSHOUR, SCOTT;MOUL, WAYNE;COVIDIEN LP;BEHNKE II, ROBERT 发明人 MOUL, WAYNE L.;BEHNKE II, ROBERT J.;FRUSHOUR, SCOTT E.M.;JENSEN, JEFFREY L.
分类号 H05K3/46;H05K3/40 主分类号 H05K3/46
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