Printed circuit boards including strip-line circuitry and methods of manufacturing same
摘要
<p>A printed circuit board includes a first layer stack and a second layer stack coupled to the first layer stack. The first layer stack includes a first electrically-insulating layer, a first electrically-conductive layer, and a cut-out area defining a void that extends therethrough. The first electrically-insulating layer includes a first surface and an opposite second surface. The first electrically-conductive layer is disposed on the first surface of the first electrically-insulating layer. The second layer stack includes a second electrically-insulating layer. The second electrically-insulating layer includes a first surface and an opposite second surface. One or more electrically-conductive traces are disposed on the first surface of the second electrically-insulating layer. The printed circuit board further includes a device at least partially disposed within the cut-out area. The device is electrically-coupled to one or more of the one or more electrically-conductive traces disposed on the first surface of the second electrically-insulating layer.</p>
申请公布号
AU2013209858(A1)
申请公布日期
2014.07.10
申请号
AU20130209858
申请日期
2013.01.16
申请人
JENSEN, JEFFREY;FRUSHOUR, SCOTT;MOUL, WAYNE;COVIDIEN LP;BEHNKE II, ROBERT
发明人
MOUL, WAYNE L.;BEHNKE II, ROBERT J.;FRUSHOUR, SCOTT E.M.;JENSEN, JEFFREY L.