| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered substrate.SOLUTION: Disclosed herein is a multilayered substrate including: a second insulating layer having a fine pattern layer formed on an upper surface thereof; and a third insulating layer having a circuit pattern layer formed on an upper surface thereof and formed of a material different from the second insulating layer, the circuit pattern layer having a pattern pitch larger than that of the fine pattern layer; thereby making it possible to solve a warpage problem and perform refinement and improvement in a degree of integration of an inner wiring. |
