| 摘要 |
<p>PROBLEM TO BE SOLVED: To solve the problem that when a plurality of LED arrays in each of which a plurality of LEDs are arranged are manufactured on a first substrate and the plurality of LED arrays on the first substrate are collectively bonded on a predetermined position on a second substrate, the number of expensive LED arrays to be used increases to manufacture a large-area display device in which a distance between LEDs is wide thereby to cause cost increase.SOLUTION: In a manufacturing method of a display device, the display device is manufactured by bonding LED chips 1 to a display substrate 4 by repeatedly perform a process of causing a bonding apparatus 27 to hold a chip formation substrate 2 in which blocks 3 are arranged at a certain block pitch, each block 3 representing a formation region where LED chips 1 are two-dimensionally arranged at a certain chip pitch, and the display substrate 4 in which bonding parts 5 are two-dimensionally arranged at a bonding part pitch equivalent to the block pitch, and detaching LED chips 1 at the same positions in the plurality of blocks 3 from the chip formation substrate 2 and bonding the LED chips 1 to the bonding parts 5 of the display substrate 4.</p> |
