| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate in which an electronic component is embedded.SOLUTION: The electronic component-embedded substrate according to the present invention includes: a first insulating layer including a cavity and in which a first circuit pattern and a second circuit pattern are provided on an upper surface and a lower surface, respectively; an electronic component in which at least a part is inserted into the cavity and having an external electrode; a plurality of built-up insulating layers stacked on an upper portion and a lower portion of the first insulating layer; an upper circuit pattern and a lower circuit pattern formed on the built-up insulating layers; and a plurality of vias connecting the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern to form an electrical loop. According to the present invention, the impedance of a path in which an electronic component and an external device are connected can be further reduced than before. |
