METAL CORE SOLDER BALL AND HEAT DISSIPATION STRUCTURE FOR SEMICONDUCTOR DEVICE USING THE SAME
摘要
<p>Disclosed is a metal core solder ball having improved heat conductivity, including a metal core having a diameter of 40 ~ 600μm, a first plating layer formed on the outer surface of the metal core, and a second plating layer formed on the outer surface of the first plating layer.</p>
申请公布号
WO2014106985(A1)
申请公布日期
2014.07.10
申请号
WO2013KR09408
申请日期
2013.10.23
申请人
DUKSAN HI-METAL CO., LTD.
发明人
CHU, YONG CHEOL;LEE, HYUN KYU;KWAK, JUNG UG;LEE, SEUNG JIN;JEON, SANG HO;CHOI, YONG SIK