| 摘要 |
FIELD: heating.SUBSTANCE: invention relates to a cooling device of semiconductor crystal (111). The cooling device for semiconductor crystal (111) includes radiator (112) thermally connected to semiconductor crystal (111) for heat dissipation, housing (150), to which radiator (112) is attached; with that, the radiator is located in housing (150), the first fluid medium flow channel (153) to provide forced fluid medium flow inside housing (150) and from it and a fluid medium flow path having the possibility of directing fluid medium in the first direction between the first fluid medium flow channel (153) and radiator (112), as well as to direct the fluid medium flow along radiator (112) in the second direction from housing (150) to it, which is different from the first direction.EFFECT: invention provides a cooling device having improved cooling capacity, which operates at lower dust absorption, lower noise, and which is compact as to dimensions at lower cost.19 cl, 16 dwg |
