| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a board built-in multilayer ceramic electronic component in which delamination phenomenon between a multilayer ceramic electronic component and a board is improved, while achieving low inductance, and to provide a multilayer ceramic electronic component built-in printed circuit board.SOLUTION: A board built-in multilayer ceramic electronic component includes a ceramic body 10 having a thickness ts of 250μm or less, a first internal electrode 21 and a second internal electrode 22 arranged to face each other via a dielectric layer, and being exposed to the side face alternately, a first external electrode 31a and a second external electrode 32a, formed on the side face of the ceramic body, and connected electrically with the first internal electrode and second internal electrode, respectively, and metal layers 31b, 32b formed on the first external electrode and second external electrode and containing copper (Cu). The thickness tp of the metal layer satisfies a relation tp≥5μm.</p> |
