PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a printed circuit board and a method for manufacturing the same.SOLUTION: The printed circuit board includes an adhesive layer interposed between an insulating layer and a circuit layer on a substrate in order to improve adhesion; and a first metal layer formed between the adhesive layer and the circuit layer. The printed circuit board has high adhesion between an insulating layer such as a resin and a circuit while having low roughness by including a polymer adhesive layer, easily forms a fine circuit and has low signal transmission loss due to the low roughness, and has high reliability due to the high adhesion.