| 摘要 |
PROBLEM TO BE SOLVED: To achieve high density in a semiconductor package having a MEMS element and thereby achieve space saving.SOLUTION: A semiconductor package 1 having a MEMS element includes: a support substrate 11 with which the MEMS element 10 is integrally formed; and a hollow cap 4 which is bonded on the support substrate 11 and covers an area above the MEMS element 10. The cap 4 is formed by an LSI chip. Further, the cap 4 is formed by a lamination structure having a wiring part on a bulk layer 41 through an insulation layer. A recessed part 41a is formed on a bottom surface of the bulk layer 41 and a space part 14 is formed between the cap 4 and the support substrate 11 by the recessed part 41a. |
