| 摘要 |
PROBLEM TO BE SOLVED: To provide a disc-shaped carrier which has high rigidity, a long lifetime and high dimensional accuracy and is low-cost and light.SOLUTION: Within a disc-shaped carrier, a reinforcing material for enhancing rigidity is provided, and exposed parts of the reinforcing material are eliminated by covering the reinforcing material with a hard resin material. The shape of the reinforcing material is such as not to be superimposed on a hole for holding a to-be-abraded object arranged in the disc-shaped carrier or a hole for abrasive grains into which abrasive grains for abrading the to-be-abraded object are poured. The structure prevents problems of occurrence of scratches in the surface of a semiconductor wafer and metallic contamination. |
