| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for mounting an LED and a method for manufacturing the substrate, in which no rinsing after processing an outer shape of the substrate is required, problems about residual contaminated water or requiring a waste water treatment are eliminated, deposition of a foreign substance or contamination on silver plating is prevented, and excellent wire bonding performance is achieved.SOLUTION: The substrate for mounting an LED includes an insulating substrate, a conductor circuit laid on the insulating substrate, a white solder resist having an opening on the conductor circuit, a silver plated terminal which is formed in an opening bottom of the solder resist and is recessed with respect to the solder resist, and an outline processed end face formed along the outline of the insulating substrate. In the substrate, a cross-section of the opening of the solder resist has an undercut shape where the opening diameter increases toward the downside. |
