CIRCUIT SUBSTRATE STRUCTURE AND METHOD FOR MANUFACTURING THEREOF

摘要

The invention provides a circuit substrate structure and a method for manufacturing thereof. The circuit substrate structure includes a substrate, a pixel array layer, a display unit, a peripheral circuit layer, at least one integrated circuit chip, a flexible printed circuit board, at least one flattening material layer and a passivation layer. In the circuit substrate structure, the flattening material layer is positioned on the peripheral circuit layer, and possesses at least one opening corresponded to and around the integrated circuit chip. By positioning the flattening material layer, the circuit substrate structure possesses a flat surface, and prevents producing air bubbles, so as to enhance the reliability of the display device.

主权项

1. A circuit substrate structure, comprising:
a substrate having a display area and a non-display area; a pixel array layer positioned on the display area of the substrate; a display unit positioned on the pixel array layer; a peripheral circuit layer positioned on the nondispiay area of the substrate, and electrically connected to the pixel array layer; at least one integrated circuit chip positioned on the peripheral circuit layer, and electrically connected to the pixel array layer; a flexible printed circuit board positioned on the peripheral circuit layer, and electrically connected to the integrated circuit chip, the pixel array layer or the combinations thereof; at least one flattening material layer positioned on the peripheral circuit layer, and covering a portion of the flexible printed circuit board, the flattening material layer having at least one opening which corresponds to and surrounds the integrated circuit chip; and a passivation layer positioned on and covering the display unit and the flattening material layer.