INTEGRATED CIRCUIT PACKAGE

摘要

An integrated circuit package comprising a substrate and at least one semiconductor die is described. A connection unit may provide electrical connections between the substrate and the semiconductor die. The connection unit may comprise a stack of conduction layers and isolation layers stacked atop each other. The stack may include a microstrip line or a coplanar waveguide. The microstrip line or the coplanar waveguide may be part of a balun, a power divider, or a directional coupler.

主权项

1. An integrated circuit package comprising:
a substrate, one or more semiconductor dies, and a connection unit configured to provide electrical connections between said substrate and said one or more semiconductor dies, wherein; said connection unit comprises
a stack comprising
one or more conduction layers and of one or more isolation layers stacked atop each other in an alternating manner,a first conduction layer comprising a microstrip conductive line, anda second conduction layer comprising a ground plane, wherein said microstrip conductive line and said ground plane form a microstrip line.