发明名称 |
REDUCING GATE HEIGHT VARIANCE DURING SEMICONDUCTOR DEVICE FORMATION |
摘要 |
In general, aspects of the present invention relate to approaches for forming a semiconductor device such as a FET with reduced gate stack height variance. Specifically, when a gate stack height variance is detected/identified between a set of gate stacks, a hard mask layer and sets of spacers are removed from the uneven gate stacks leaving behind (among other things) a set of dummy gates. A liner layer and an inter-layer dielectric are formed over the set of dummy gates. The liner layer is then removed from a top surface (or at least a portion thereof) of the set of dummy gates, and the set of dummy gates are then removed. The result is a set of gate regions having less height variance/disparity. |
申请公布号 |
US2014193957(A1) |
申请公布日期 |
2014.07.10 |
申请号 |
US201313738270 |
申请日期 |
2013.01.10 |
申请人 |
GLOBALFOUNDRIES INC. |
发明人 |
Jha Ashish K.;Kim Tae-Hoon;Lee Tae Hoon;Maeng Chang Ho;Srivathanakul Songkram;Wang Haiting |
分类号 |
H01L21/8238 |
主分类号 |
H01L21/8238 |
代理机构 |
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代理人 |
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主权项 |
1. A method for reducing gate height variance in a semiconductor device, comprising:
removing a hard mask layer and a set of spacers from a set of dummy gates; depositing a liner layer and an inter-layer dielectric (ILD) over the set of dummy gates; removing the liner layer from at least a portion of a top surface of the set of dummy gates; and removing the set of dummy gates. |
地址 |
Grand Cayman KY |