STACKED SEMICONDUCTOR PACKAGE INCLUDING CONNECTIONS ELECTRICALLY CONNECTING FIRST AND SECOND SEMICONDUCTOR PACKAGES

摘要

A stacked semiconductor package has a first semiconductor package including a first package substrate and a first semiconductor chip mounted on the first package substrate, a second semiconductor package including a second package substrate and a second semiconductor chip mounted on the second package substrate, and a plurality of connections electrically connecting the first and second semiconductor packages. The connections are disposed on an outer region of the first package substrate outside the first semiconductor chip. The connections are disposed along opposite first longer sides and opposite shorter second sides of the first package substrate. The heights of those connections disposed along each longer first side gradually vary from a central to an outer region (i.e., the ends) of the longer first side.

主权项

1. A method of fabricating a stacked semiconductor package, the method comprising:
providing a first semiconductor package including a first package substrate and a first semiconductor chip mounted on the first package substrate, the first package substrate having lateral first and second sides constituting the outer peripheral region thereof, wherein the first side is longer than the second side; providing a second semiconductor package including a second package substrate and a second semiconductor chip mounted on the second package substrate; forming a stack in which the first and second semiconductor packages are juxtaposed with a top surface of the first package substrate facing a bottom surface of the second package substrate, and providing a plurality of connections between an outer region of the top surface of the first package substrate outside the first semiconductor chip and a region of the bottom surface of the second package substrate aligned with the outer region in the stack, including along the first longer side of the first package substrate, wherein a first group of the connections is provided along the longer first side of the first package substrate as spaced from one another along the longer first side, and the heights of the connections of the first group are varied from a central to an outer region of the longer first side; and subsequently heat treating the connections to fix the second semiconductor package to the first semiconductor package.