Multi-Chip Package Assembly with Improved Bond Wire Separation

摘要

A multi-chip package is disclosed that has a construction capable of preventing and/or reducing electrical shorts caused by shifts in bond wires. The multi-chip package includes a die attach formed between connection points of a bond wire. The die attach is made of a non-conductive material and can be constructed so as to support or encompass a portion of the bond wire. By contacting the bond wire, the die attach restricts the motion of the bond wire by acting as a physical barrier to the bond wire's movement and/or as a source of friction. In this manner, undesired position shifts of the bond wires can be prevented, reducing device failures and allowing for improved manufacturing allowances.

主权项

1. A multi-chip package, comprising:
a first semiconductor die having a first metal contact; a second semiconductor die that overlaps the first semiconductor die, the second semiconductor die having a second metal contact; a plurality of lead fingers; a first bond wire electrically connecting a first one of the plurality of lead fingers to the first metal contact of the first semiconductor die; a second bond wire electrically connecting a second one of the plurality of lead fingers to the second metal contact of the second semiconductor die; and a first die attach composed of an insulating material and disposed between the first metal contact and the first one of the plurality of lead fingers, the first die attach restricting relative motion of the first bond wire.