| 发明名称 |
ELECTROLESS PLATING OF COBALT ALLOYS FOR ON CHIP INDUCTORS |
| 摘要 |
A method for forming an on-chip magnetic structure includes forming a seed layer over a substrate of a semiconductor chip. The seed layer is patterned to provide a plating location. A cobalt based alloy is electrolessly plated at the plating location to form an inductive structure on the semiconductor chip. |
| 申请公布号 |
US2014191362(A1) |
申请公布日期 |
2014.07.10 |
| 申请号 |
US201313968107 |
申请日期 |
2013.08.15 |
| 申请人 |
International Business Machines Corporation |
发明人 |
Gallagher William J.;O'Sullivan Eugene J.;Wang Naigang |
| 分类号 |
H01L49/02 |
主分类号 |
H01L49/02 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An on-chip magnetic structure, comprising:
a patterned seed layer formed over a substrate of a semiconductor chip to provide a plating location; and a magnetic structure including an electrolessly plated cobalt based alloy formed at the plating location, the inductive structure including at least one of a yoke and a coil. |
| 地址 |
Armonk NY US |
