发明名称 HIGH SPEED SUBSTRATE INSPECTION APPARATUS AND METHOD USING THE SAME
摘要 Disclosed in the present invention are a high speed substrate inspecting apparatus which uses continuous light and improves a light processing speed, and a high speed substrate inspecting method using the same. The high speed substrate inspecting apparatus comprises: a substrate transfer unit which transfers a substrate; an optical module which allows the incidence of light toward the substrate, and obtains an image of the substrate using light reflected from the substrate; and an optical module transfer unit which supports the optical module and transfers the optical module. The optical module comprises: a light source which radiates light; an incidence optical system which guides the light to a transferred substrate; a first reflecting optical system which separates the light reflected from the substrate into first reflected light and second reflected light, and guides the first reflected light to a different path from the path of the second reflected light; a first optical sensor which detects the first reflected light; a second reflecting optical system which guides the second reflected light to a different path from the path of the first reflected light; a second optical sensor which detects the second reflected light; and a focus matching unit which regulates the focus of incidence light to the substrate using the first reflected light detected by the second optical sensor.
申请公布号 KR20140087244(A) 申请公布日期 2014.07.09
申请号 KR20120156694 申请日期 2012.12.28
申请人 LIGADP CO., LTD. 发明人 EO, UK SEON;JEONG, CHAN HEE
分类号 G01N21/88;G01B11/30 主分类号 G01N21/88
代理机构 代理人
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