发明名称 Light emitting device package
摘要 Disclosed is a light emitting device package (200A) which includes a substrate (210) having a cavity including a side wall and a bottom surface, a light emitting device (100) disposed in the cavity (212), a support unit (210, 260) including a first region, and a second region bent from the first region and disposed on the side wall of the cavity, and a light-transmitting unit (230) adhered to the first region such that the light-transmitting unit is spaced from the light emitting device (D), the light-transmitting unit (230) transmitting light emitted from the light emitting device (100), wherein a distance (D) between an upper surface of the light emitting device and the light transmission unit is 0.15 mm to 0.35 mm.
申请公布号 EP2752896(A2) 申请公布日期 2014.07.09
申请号 EP20140150412 申请日期 2014.01.08
申请人 LG INNOTEK CO., LTD. 发明人 KIM, BYUNG MOK;KODAIRA, HIROSHI;KIM, HA NA;TANDA, YUICHIRO;OZEKI, SATOSHI
分类号 H01L33/48;H01L33/56;H01L33/58 主分类号 H01L33/48
代理机构 代理人
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