| 摘要 |
Disclosed is a crimping terminal that suppresses as far as possible an increase in contact resistance with an electrical wire even in a severe thermal impact environment. A crimping terminal (10) is formed into a substantial U-shape section with a bowed bottom plate (21). Also, a bead (31) is formed whose in inner surface is made convex (31T) by punching a concave shape from an outer surface of a wall plate, on the wall plate at any position in a range from at least a bottom plate (21) to a conductor swage piece (22). A work hardening portion (E) hardened by crushing at a center portion in a width direction of the bottom plate (21) is also formed. This increases rigidity of a portion from a center of a width direction of the semiconductor crimping portion (12) bottom plate (21) to the semiconductor swage piece (22), so it is possible to suppress as much as is possible an increase in contact resistance with a wire even in severe thermal impact environments. |
