摘要 |
Provided is a machining device capable of compensating the linear mobility of a patterning head and accordingly performing removal in a P2 process with high preciseness. A device, which performs a patterning process of forming grooves on a substrate by relatively-moving the patterning head on a horizontal plane against a stage at least in one axial direction while the substrate is fixed onto the stage, includes a calibration line which is extended in the axial direction on the stage. While relatively-moving the patterning head against the stage the same as in the case of the patterning process, the device takes images of the calibration line using an imaging means. Based on the displacement of the calibration line in the direction vertical to the axial direction of the calibration line occurring in the acquired images, the processing point by a patterning tool during the patterning can be compensated. |