LASER DIODE PACKAGE AND MANUFACTURING THE SAME

摘要

The present invention provides a laser diode package comprising a support unit; a laser diode which is disposed on the support unit and generates light; an optical fiber member which is disposed in order for the light generated in the laser diode to be radiated thereon; a sub-mount which is formed on the support unit and supports the optical fiber member; and a solder unit which fixes the optical fiber member to the sub-mount.