| 摘要 |
<p>The present invention relates to a photosensitive resin composition which is characterized by containing (A) an alkali-soluble resin, (B) a photopolymerizable compound, (C) a photopolymerization initiator, (D) a thermosetting compound, and (E) a solvent, wherein the (D) thermosetting compound has a structure of the following chemical formula 1 or chemical formula 2. [Chemical formula 1] (R1-R5 are independently a hydroxyl group, -R6-R7, or -R7, the R6 is an alkyl group having one to six carbon atoms or an alkoxy group having one to six carbon atoms, R7 is a hydroxyl group, an epoxy group, or an alkoxy group of one to six carbon atoms substituted by an epoxy group, and all the R1-R7 cannot be hydroxyl group.) [Chemical formula 2] (The R8-R11 are independently a hydroxyl group, R12-R13, or R13, the R12 is an alkyl group having one to six carbons or an alkoxy group having one to six carbons substituted or unsubstituted by a hydroxyl group, R13 is a hydroxyl group, an epoxy group, or an alkoxy group having one to six carbon atoms substituted by an epoxy group, and all the R8-R13 cannot be a hydroxyl group.).</p> |
