LED PACKAGE AND METHOD FOR MANUFACTURING THEREOF

摘要

Disclosed are an LED package with improved reliability and a method for manufacturing the same. The LED package comprises a lead frame; an LED chip mounted on the upper surface of the lead frame; an antistatic element mounted on the lower surface of the lead frame; a reinforcement layer formed to cover at least the antistatic element in some areas of the lower surface thereof; and a housing having an aperture part formed to expose the LED chip to the outside. The method for manufacturing an LED package comprises the steps of mounting the LED chip on the upper surface of the lead frame and mounting the antistatic element on the lower surface of the lead frame; reinforcing some areas of the lower surface of the lead frame at least including the antistatic element with a reinforcement member; and forming the housing which includes the aperture part to expose the LED chip to the outside.