| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin material being excellent in thermal conductivity, being also excellent in thermal stability at molding such as injection molding, and indicating sufficient appearance. <P>SOLUTION: The high thermal conductive thermoplastic resin composition contains one kind or more of stabilizers selected from among a phosphite based stabilizer, a thioether based stabilizer and a phenol based stabilizer relative to a high thermal conductive thermoplastic resin with a specific structure comprising repetition of a unit composed of a mesogen group and a spacer and having thermal conductivity in a single resin of 0.45 W/(mK) or more. <P>COPYRIGHT: (C)2011,JPO&INPIT |
