| 摘要 |
The present invention relates to a method for encapsulating an organic light emitting device which includes the steps of: (a) forming a first encapsulation layer on the surface of the organic light emitting device at a preset deposition speed; and (b) forming a second encapsulation layer on the surface of the first encapsulation layer at a deposition speed which is slower or faster than the preset deposition speed. Thereby, a negative electrode layer and an organic thin film layer of the organic light emitting device are protected from oxygen or moisture by completely suppressing a gap generation of an encapsulation layer by depositing the dual encapsulation layer while the deposition speed is controlled. |
