发明名称 SUBSTRATE EMBEDDING PASSIVE ELEMENT
摘要 The present invention relates to a substrate embedded with a passive element which includes a first conductive pattern layer on a lower side thereof, a second conductive pattern layer on an upper side thereof, and the passive element with an external electrode. The substrate embedded with the passive element includes: a first via which electrically connects the lower side of the external electrode to the first conductive pattern layer; and a second via which electrically connects the upper side of the external electrode to the second conductive pattern layer. The volume of the first via can be larger than the volume of the second via.
申请公布号 KR20140087740(A) 申请公布日期 2014.07.09
申请号 KR20120158335 申请日期 2012.12.31
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 LEE, DOO HWAN;CHUNG, YUL KYO;SHIN, YEE NA;LEE, SEUNG EUN
分类号 H05K3/46;H05K1/18 主分类号 H05K3/46
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