SUBSTRATE EMBEDDING ELECTRONIC COMPONENT AND MANUFACTURING MEHTOD THEREOF

摘要

The present invention relates to an electronic component-embedded substrate. The electronic component-embedded substrate comprises: a first insulating layer which includes a cavity and is provided with a first circuit pattern and a second circuit pattern on upper and lower surfaces thereof; an electronic component, at least a portion of which is inserted into the cavity, and which includes an external electrode; a plurality of build-up insulating layers which are laminated on upper and lower sides thereof; an upper circuit pattern and a lower circuit pattern which are formed on the build-up insulating layers; a plurality of vias which connect the external electrode, the upper circuit pattern, the first circuit pattern, the second circuit pattern, and the lower circuit pattern to form an electric loop. Therefore, an impedance of a path through the electronic component and an external device is connected can be reduced, compared to the prior art.