| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin molding apparatus which can improve molding quality by measuring the thickness of an article to be molded in advance of resin molding, and then changing the cavity volume. SOLUTION: A thickness measuring unit B comprises: a conveyance plate 9 which conveys an article to be molded 1, where a semiconductor chip is mounted on a substrate, loaded from a loader 25 while holding; an X-Y scanning mechanism 10 which can scan the conveyance plate in the X-Y direction; and a first laser displacement gauge 44 which measures total thickness of the substrate including the semiconductor chip, and a second laser displacement gauge 44 which measures the thickness only of the substrate, that are arranged under the conveyance path of the conveyance plate 9 corresponding to the article to be molded 1. COPYRIGHT: (C)2012,JPO&INPIT |
