发明名称 Shape memory material on the basis of a structural adhesive
摘要 Composition comprises at least a curable structural adhesive, and at least a chemically crosslinked elastomer, where the elastomer is present as a penetrating polymer network in the structural adhesive. Independent claims are included for: (1) a method for preparing the composition comprising mixing the epoxy resin A with the curing agent B, adding and mixing the curing agent H, reacting the epoxy resin A with the curing agent H, or mixing the epoxy resin A with the curing agent H and B, reacting the epoxy resin A with the curing agent H at a temperature below the activation temperature of the curing agent B; (2) a molded body, which is subjected to a reversible molding process comprising heating the composition to a temperature above its glass transition temperature, molding the composition under the tension of chemically crosslinked elastomer, and cooling the molded composition below its glass transition temperature; and (3) a reinforcement element for reinforcing cavities in structural components comprising a carrier at which the molded body is mounted.
申请公布号 EP2553035(B1) 申请公布日期 2014.07.09
申请号 EP20110709970 申请日期 2011.03.25
申请人 SIKA TECHNOLOGY AG 发明人 FINTER, JÜRGEN;GÖSSI, MATTHIAS
分类号 C09J163/00;C09J175/00 主分类号 C09J163/00
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