发明名称 |
Copper plating bath and method |
摘要 |
<p>Copper plating baths containing a leveling agent that is a reaction product of one or more of certain pyridine compounds with one or more epoxide-containing compounds, that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.</p> |
申请公布号 |
EP2586893(A3) |
申请公布日期 |
2014.07.09 |
申请号 |
EP20120189639 |
申请日期 |
2012.10.23 |
申请人 |
ROHM AND HAAS ELECTRONIC MATERIALS LLC |
发明人 |
NIAZIMBETOVA, ZUHRA L.;RZEZNIK, MARIA ANNA |
分类号 |
C25D3/38 |
主分类号 |
C25D3/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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