发明名称 IMPROVED HEAT DISSIPATION FOR LOW PROFILE DEVICES
摘要 A heat spreader for an electronic device including a first layer formed of at least one sheet of compressed particles of exfoliated graphite having two major surfaces; and a second layer formed of a metal foil having two major surfaces, a first major surface of the metal foil having surface structures thereon, wherein a first major surface of the graphite layer and a second major surface of the metal foil layer are in thermal connection with each other, the surface structures on the first major surface of the metal foil which create airflow turbulence, increase heat dissipation surface area, or both.
申请公布号 KR101418025(B1) 申请公布日期 2014.07.09
申请号 KR20117003161 申请日期 2008.07.10
申请人 发明人
分类号 G06F1/20;H05K7/20 主分类号 G06F1/20
代理机构 代理人
主权项
地址